Chilldyne, a pioneering firm in direct-to-chip liquid cooling, has revealed its latest innovation: a plug-and-play cooling distribution unit (CDU) dubbed the “data center liquid cooling starter kit.” This offering leverages Chilldyne’s patented “negative pressure” liquid cooling technology, which ensures that in the event of a leak, fluid moves away from sensitive electronics rather than causing damage.

The CDU starter kit aims to equip data centers for the demands of AI workloads, enabling rapid adaptation to the next generation of chips from industry giants like Nvidia, Intel, and AMD. Each standard kit includes two CF-CDU300 CDUs optimized for negative pressure liquid cooling, capable of handling cold plates with up to 2,000-watt TDP. Additionally, hybrid air-liquid options are available for backup cooling, ensuring robust performance up to 150 kW cooling per rack.

Dr. Steve Harrington, CEO of Chilldyne, expressed enthusiasm about the new product, stating, “We are excited to introduce our data center liquid cooling starter kit to the market. Our goal is to develop real, practical liquid cooling solutions that address the growing challenges faced by HPC and colocation data center operators in the era of artificial intelligence. By offering a Liquid Cooling Starter Kit capable of supporting high-density racks, we are confident that we can help our customers achieve their goals of increased efficiency, sustainability, and reliability.”

Chilldyne emphasizes the reliability of its A/B redundant liquid cooling system, designed to ensure maximum uptime with no single point of failure.

Direct-to-chip liquid cooling improves data centers operations by enhancing their efficiency and sustainability. This technology directly targets the hottest components, such as CPUs and GPUs, thereby reducing the need for extensive air conditioning and lowering overall energy consumption and improving sustainability goals.