In response to surging demand for AI-ready data center capacity worldwide, Vertiv has unveiled its latest innovation, the Vertiv™️ MegaMod™️ CoolChip. This prefabricated modular (PFM) data center solution integrates cutting-edge technologies, including high-density liquid cooling, aimed at swiftly deploying critical digital infrastructure for AI computing. By leveraging offsite fabrication efficiencies and advanced cooling capabilities, the MegaMod CoolChip promises to reduce deployment times by up to 50% compared to traditional onsite construction methods.

Engineered to cater specifically to the needs of AI compute environments, the MegaMod CoolChip supports leading AI compute platforms with customizable configurations. It boasts features such as direct-to-chip liquid cooling, high-efficiency power protection and distribution systems, and modular assembly options. These capabilities enable seamless integration into both new and existing data center facilities, accommodating power requirements ranging from hundreds of kilowatts to multiple megawatts.

Viktor Petik, Vice President of Vertiv infrastructure solutions, emphasized the solution’s readiness and efficiency: “MegaMod CoolChip is a fully equipped critical digital infrastructure solution that customers can deploy quickly and with confidence. Factory assembly and testing in a controlled environment help to accelerate the time to build, as well as providing control over cost and schedules.”

Vertiv’s extensive experience in prefabricated modular data centers, coupled with insights into AI deployment needs, underpins the development of the MegaMod CoolChip. The solution not only addresses current AI computing demands but is also positioned to meet future requirements, aligning closely with sustainability goals through enhanced energy efficiency.